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Yuhao Chen 陈宇豪 Master Student, September 2021~ Department of Electronic Engineering, Tsinghua University, Beijing 100084, China Research Interests: Channel Estimation, RIS Address: Room 8-212, Tsinghua-Rohm EE Hall, Tsinghua University, Beijing 100084, China
Tel: +86-10-62795153-805
E-mail: chenyuha17@mails.tsinghua.edu.cn
Homepage: https://ghasempour.princeton.edu/people/yuhao-chen |
Biography
Yuhao Chen is a senior undergraduate student in the Department of Electronic Engineering of Tsinghua University. He will become a master candidate from September, 2021 under the supervision of Professor Linglong Dai. Mr. Chen’s research interest is beamforming design for Teraherz communications.
Awards
Publications
Journal Papers
[J5] Y. Chen and L. Dai, “Coded beam training for RIS assisted wireless communications,” IEEE Trans. Wireless Commun., vol. 24, no. 5, pp. 3854-3867, May 2025.
[J4] Y. Chen, M. Jian, and L. Dai, “Channel estimation for RIS assisted wireless communications: Stationary or non-stationary?,” IEEE Trans. Signal Process., vol. 72, pp. 3776-3791, Aug. 2024.
[J3] Y. Chen and L. Dai, “Non-stationary channel estimation for extremely large-scale MIMO,” IEEE Trans. Wireless Commun., vol. 23, no. 7, pp. 7683-7697, Jul. 2024.
[J2] M. Cui, H. Jiang, Y. Chen, Y. Du, and L. Dai, “Continuous-time channel prediction based on tensor neural ordinary differential equation,” China Commun., vol. 21, no. 1, pp. 163-174, Jan. 2024.
[J1] Y. Chen, J. Tan, M. Hao, R. MacKenzie, and L. Dai, “Accurate beam training for RIS-assisted wideband terahertz communication,” IEEE Trans. Commun., vol. 71, no. 12, pp. 7425-7440, Dec. 2023.
Conference Papers
[C2] Y. Chen, J. Tan, and L. Dai, “Analytical beam training for RIS-assisted wideband terahertz communication,” in Proc. 2023 IEEE Global Commun. Conf. (IEEE GLOBECOM’23), Kuala Lumpur, Malaysia, Dec. 2023.
[C1] M. Cui, Z. Wu, Y. Chen, S. Xu, F. Yang, and L. Dai, “Demo: Low-power communications based on RIS and AI for 6G,” in Proc. IEEE Int. Conf. Commun. (IEEE ICC’22, Demo Session), Gangnam-gu, Seoul, South Korea, May 2022. (IEEE ICC 2022 Outstanding Demo Award)