Xiuhong Wei 魏秀红

Master Student, September 2019~

Department of Electronic Engineering, Tsinghua University, Beijing 100084, China

Research Interests: Channel Estimation, Signal Detection

Address: Room 8-212, Tsinghua-Rohm EE Hall, Tsinghua University, Beijing 100084, China

Tel: +86-10-62795153-()

E-mail: weixh19@mails.tsinghua.edu.cn

Homepage: http://oa.ee.tsinghua.edu.cn/dailinglong/members/xiuhongwei

Biography

Xiuhong Wei received the B.S. degree in the School of Mechanical, Electrical and Information Engineering, Shandong University, Weihai in 2019, and then she became a master student in the Department of Electronic Engineering, Tsinghua University since Sep. 2019. Her current research interests include channel estimation for massive MIMO and RIS assisted communications, and deep learning for wireless communications.

Awards

  1. National Scholarship, 2016
    2016年度国家奖学金
  2. National Scholarship, 2017
    2017年度国家奖学金
  3. Outstanding student of Shandong Province, 2017
    2017年度山东省优秀学生
  4. National Scholarship, 2018
    2018年度国家奖学金
  5. The Tsinghua University first class comprehensive scholarship for graduate students, 2020
    2020年清华大学研究生综合一等奖学金
  6. Third Prize of National Artificial Intelligence Competition (4/1839), 2020
    2020年全国人工智能大赛三等奖

Publications

Journal Papers

[J4] X. Wei, and L. Dai, “Channel estimation for extremely large-scale massive MIMO far-field near-field or hybrid-field?,” IEEE Commun. Lett., 2021.

[J3] X. Wei, D. Shen, and L. Dai, “Channel estimation for RIS assisted wireless communications: Part II - an improved method based on double-structured sparsity,” IEEE Commun. Lett., vol. 25, no. 5, pp. 1403-1407, May 2021. (Invited Paper)

[J2] X. Wei, D. Shen, and L. Dai, “Channel estimation for RIS assisted wireless communications: Part I - fundamentals, solutions, and future opportunities,” IEEE Commun. Lett., vol. 25, no. 5, pp. 1398-1402, May 2021. (Invited Paper)

[J1] X. Wei, C. Hu, and L. Dai, “Deep learning for beamspace channel estimation in millimeter-wave massive MIMO systems,” IEEE Trans. Commun., vol. 69, no. 1, pp. 182-193, Jan. 2021.